iPhone 18 Pro Camera Upgrade: Variable Aperture to Cost 50% More
Apple's iPhone 18 Pro camera will feature a variable aperture lens, but its average selling price is expected to jump by 50%. A new ultra-wide camera design is also slated for 2028 iPhones.
Future iPhone models are set to receive significant camera hardware advancements, most notably a variable aperture lens for the iPhone 18 Pro and a revised ultra-wide camera module for iPhones released in 2028. These upgrades, detailed by analyst Ming-Chi Kuo, are projected to come with a substantial cost increase, particularly the component for the iPhone 18 Pro.
The upcoming iPhone 18 Pro is anticipated to incorporate a main camera with a variable aperture, a departure from the fixed-aperture design currently used. According to Kuo's analysis, this new variable aperture lens will command an average selling price that is 50% higher than Apple's existing high-end 7P lens system. This cost hike is attributed in part to Apple's sourcing strategy, with Sunny Optical expected to supply 40-50% of these critical components. Largan will reportedly continue to be the primary supplier.
While this component price increase alone might not directly translate to a higher retail price for the iPhone 18 Pro and its larger counterpart, the iPhone 18 Pro Max, it arrives at a challenging juncture. Apple is already contending with escalating memory costs, which are placing pressure on the company's profit margins. The added expense for the camera module could further complicate these financial considerations.
Future Designs for Ultra-Wide Cameras
Beyond the immediate upgrades for the iPhone 18 Pro, Kuo also provided insights into the camera modules planned for iPhones in 2028. These future devices are expected to feature an ultra-wide camera module that will transition away from the current flip-chip packaging method. Instead, Apple is planning to adopt an improved chip-on-board (COB) design for this lens. The flip-chip approach involves mounting the image sensor face-down, with connections made through minuscule solder bumps to the module substrate. The COB design represents a shift in how the sensor is integrated into the module.
Kuo did not elaborate on the specific technical advantages that led Apple to opt for the improved COB design over flip-chip packaging for the ultra-wide camera. However, he indicated that Sunny Optical is also in a strong position to become a supplier for these future components. The analyst's full report also touches upon Sunny Optical's work in optical components for potential devices from OpenAI, including a rumored smartphone and other mobile devices.
These forthcoming changes in Apple's iPhone camera technology underscore a consistent drive towards enhancing imaging capabilities. The variable aperture, a feature more commonly found in professional-grade cameras, allows for greater control over depth of field and low-light performance. The move to a new packaging method for the ultra-wide camera suggests a pursuit of improved performance, potentially in areas like image stabilization, size reduction, or manufacturing efficiency. The long-term roadmap indicates a continuous evolution in the fundamental hardware powering the devices that millions rely on daily.