Pixel 11 First with 2nm Chip, MediaTek Modem
Google's upcoming Pixel 11 lineup is set to feature the first smartphone System-on-Chip (SoC) built on TSMC's 2nm process. The devices will also reportedly adopt MediaTek's new M90 modem.

Google's forthcoming Pixel 11 smartphone series is poised to debut with a significant technological leap, as reports indicate it will house the industry's first 2-nanometer (nm) System-on-Chip (SoC) for a smartphone. This cutting-edge processor, expected to be named the Tensor G6, will be manufactured by TSMC. This move would place Google's devices ahead of anticipated releases from competitors like Qualcomm, MediaTek, and Apple, which are expected to feature chips built on less advanced processes in devices launching later in the year.
The Pixel 11 family is slated for an official unveiling on August 12, 2026, according to Google's own confirmations. This earlier announcement timeline, compared to rivals whose new flagship chips are anticipated in September 2026 announcements, lends credence to the possibility of Google securing early access to TSMC's next-generation manufacturing node.
New Modem Promises Connectivity Boost
Further enhancing the Pixel 11's technological profile, an FCC filing for the Pixel 11 Pro Fold has shed light on a critical component upgrade: the modem. Google appears to be transitioning away from Samsung's Exynos Modem family, a move that has been a point of speculation. The new Pixels are expected to integrate MediaTek's M90 modem. This new modem promises support for impressive 5G speeds, reaching up to 12 gigabits per second (Gbps), and incorporates satellite connectivity capabilities, alongside dual active 5G SIM support.
This strategic shift away from Samsung modems, which have been associated with connectivity issues in previous Pixel generations, suggests a strong focus on improving the reliability and performance of mobile data and communication for the Pixel 11 series. The move to a more advanced manufacturing process for the SoC and the adoption of a next-generation modem underscore Google's commitment to pushing the boundaries of smartphone hardware.
The adoption of TSMC's 2nm process technology represents a substantial advancement in semiconductor manufacturing. This node allows for smaller, more power-efficient transistors, leading to chips that offer greater processing power within the same or smaller physical footprints, and consume less energy. For consumers, this translates to potentially faster app performance, improved battery life, and enhanced capabilities for demanding tasks such as artificial intelligence processing and high-resolution media playback. The competitive landscape for smartphone SoCs is intensely fierce, with Qualcomm, MediaTek, and Apple constantly vying for technological supremacy. Google's reported move to the 2nm process could signify a significant competitive advantage for its Pixel line, positioning it at the forefront of mobile technology innovation.
The integration of satellite connectivity via the MediaTek modem could also be a game-changer, offering a safety net for users in areas with no traditional cellular coverage. This feature, becoming increasingly prevalent in high-end smartphones, enhances user safety and provides a more seamless connected experience, regardless of location. The Pixel 11 Pro Fold's appearance in FCC filings serves as a strong indicator of the impending launch and the technological specifications that users can expect.
By securing the first implementation of TSMC's 2nm process, Google aims to differentiate its flagship devices in a crowded market. The combination of a leading-edge processor and a sophisticated new modem could redefine user expectations for performance, efficiency, and connectivity in smartphones throughout 2026 and beyond.
